Introduction
The B-L462E-CELL1 Discovery kit is a turnkey development platform for cellular IoT devices. The Discovery kit contains a
low-power Discovery main board powered by an LBAD0ZZ1SE module, a global coverage antenna, and a fan-out board.
The LBAD0ZZ1SE module includes an STM32L462REY6TR microcontroller, an LBAD0XX1SC-DM ultra-small LTE Cat M/NB
modem, and an ST4SIM-200M GSMA-certified embedded SIM with a prepaid cellular connectivity data plane. ST4SIM-200M
can also be used as an embedded secure element (eSE) for application.
STMod+ and extended pins connectivity provide unlimited expansion capabilities with a large choice of specialized add-on
boards. Moreover, the fan-out board supports add-on boards using mikroBUS
™
, ESP‑01, Grove I
2
C, Grove UART, and
breadboard. The B-L462E-CELL1 Discovery kit includes an ST-LINK debugger/programmer and comes with the comprehensive
STM32Cube software libraries together with packaged software examples to demonstrate end-to-end connectivity.
This document provides information about the Discovery kit hardware features and instruction to run the demonstration
application software.
Figure 1. B-L462E-CELL1 Discovery kit for IoT nodes
Picture is not contractual.
Discovery kit for LTE Cat M/NBIoT with STM32L4 Series
UM2743
User manual
UM2743 - Rev 1 - March 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
1 Features
• LBAD0ZZ1SE module from Murata powered by STM32L462RE with built-in eSIM (ST4SIM-200M), LTE
Cat M/NBIoT modem (LBAD0XX1SC-DM), and 1 Mbyte of Quad-SPI Flash memory
• Ultra-low-power STM32L4 Series STM32L462REY6TR microcontroller based on the Arm
®
Cortex
®
-M4 core
with 512 Kbytes of Flash memory and 160 Kbytes of RAM in a WLCSP64 package
• 64 Mbytes of onboard Quad-SPI Flash memory from Micron
®
, exclusive with the 1 MByte of Quad-SPI Flash
memory inside the module
• 16 Kbytes of I
2
C EEPROM (M24128-DFMN6TP) from STMicroelectronics
• 0.96-inch 128 x 64 OLED screen with SPI interface
•
Low-power Audio CODEC with PCM bus and I
2
C interface (MAX9867ETJ+ from Maxim)
• Ultra-low-power 3D accelerometer and 3D magnetometer (LSM303AGR) from STMicroelectronics
• Capacitive digital sensor for relative humidity and temperature (HTS221) from STMicroelectronics
• 260-1260 hPa absolute digital output barometer (LPS22HH) from STMicroelectronics
• 3 user LEDs
• 2 push-buttons (user and reset)
• Board connectors:
– SMA antenna connector
– Two 50-pin 2.54 mm pitch headers
– STMod+
– micro-SIM card slot
– 3.5 mm CTIA stereo headset jack including analog microphone input
– USB Micro-B connectors for power, USARTs, USB device, and ST-LINK/V2-1
– TAG10
– mikroBUS
™
expansion connectors
– ESP‑01 expansion connector
– Grove Seeed Studio
™
breadboard, I
2
C, and UART expansion connectors
• Flexible power-supply options: ST-LINK USB, User USB, UART USB, Power USB, or three AAA batteries
• On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual
COM port, and debug port
• End-to-end connectivity applications
• Low‑power cellular network services from Truphone
®
• Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded
Workbench
®
, MDK-ARM, and STM32CubeIDE
Note: Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
UM2743
Features
UM2743 - Rev 1
page 2/58
