This is information on a product in full production.
October 2019 DS10693 Rev 7 1/198
STM32F446xC/E
Arm
®
Cortex
®
-M4 32-bit MCU+FPU, 225 DMIPS, up to 512 KB Flash/128+4 KB RAM,
USB OTG HS/FS, seventeen TIMs, three ADCs and twenty communication interfaces
Datasheet - production data
Features
• Core: Arm
®
32-bit Cortex
®
-M4 CPU with FPU,
Adaptive real-time accelerator (ART
Accelerator) allowing 0-wait state execution
from Flash memory, frequency up to 180 MHz,
MPU, 225 DMIPS/1.25 DMIPS/MHz
(Dhrystone 2.1), and DSP instructions
• Memories
– 512 Kbytes of Flash memory
– 128 Kbytes of SRAM
– Flexible external memory controller with up
to 16-bit data bus: SRAM, PSRAM,
SDRAM/LPSDR SDRAM, NOR/NAND
Flash memories
– Dual mode QuadSPI interface
• LCD parallel interface, 8080/6800 modes
• Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4 to 26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC (1%
accuracy)
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
• Low power
– Sleep, Stop and Standby modes
–V
BAT
supply for RTC, 20×32 bit backup
registers plus optional 4 KB backup SRAM
• 3×12-bit, 2.4 MSPS ADC: up to 24 channels
and 7.2 MSPS in triple interleaved mode
• 2×12-bit D/A converters
• General-purpose DMA: 16-stream DMA
controller with FIFOs and burst support
• Up to 17 timers: 2x watchdog, 1x SysTick timer
and up to twelve 16-bit and two 32-bit timers up
to 180 MHz, each with up to four IC/OC/PWM
or pulse counter
• Debug mode
– SWD and JTAG interfaces
–Cortex
®
-M4 Trace Macrocell™
• Up to 114 I/O ports with interrupt capability
– Up to 111 fast I/Os up to 90 MHz
– Up to 112 5 V-tolerant I/Os
• Up to 20 communication interfaces
– SPDIF-Rx
– Up to 4 × I
2
C interfaces (SMBus/PMBus)
– Up to four USARTs and two UARTs
(11.25 Mbit/s, ISO7816 interface, LIN,
IrDA, modem control)
– Up to four SPIs (45 Mbits/s), three with
muxed I
2
S for audio class accuracy via
internal audio PLL or external clock
– 2 x SAI (serial audio interface)
– 2 × CAN (2.0B Active)
– SDIO interface
– Consumer electronics control (CEC) I/F
• Advanced connectivity
– USB 2.0 full-speed device/host/OTG
controller with on-chip PHY
– USB 2.0 high-speed/full-speed
device/host/OTG controller with dedicated
DMA, on-chip full-speed PHY and ULPI
– Dedicated USB power rail enabling on-chip
PHYs operation throughout the entire MCU
power supply range
• 8- to 14-bit parallel camera interface up to
54 Mbytes/s
• CRC calculation unit
• RTC: subsecond accuracy, hardware calendar
• 96-bit unique ID
Table 1. Device summary
Reference Part numbers
STM32F446xC/E
STM32F446MC, STM32F446ME,
STM32F446RC, STM32F446RE,
STM32F446VC, STM32F446VE,
STM32F446ZC, STM32F446ZE.
LQFP64 (10 × 10 mm)
LQFP100 (14 × 14 mm)
LQFP144 (20 x 20 mm)
UFBGA144 (7 x 7 mm)
UFBGA144 (10 x 10 mm)
WLCSP 81
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